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Rogers RO3035 High Frequency Printed Circuit Board 2-Layer Rogers 3035 30mil 0.762mm PCB with DK3.5 DF 0.0015

Categories Arlon PCB Board
Brand Name: Bicheng Technologies Limited
Model Number: BIC-0043-V0.82
Certification: UL
Place of Origin: China
MOQ: 1
Price: USD 2.99-9.99 PER PIECE
Payment Terms: T/T, Western Union
Supply Ability: 45000 pieces per month
Delivery Time: 10 working days
Packaging Details: Vacuum
Number of Layers: 2
Glass Epoxy:: RO3035
Final foil: 1OZ
Final height of PCB:: 0.8 mm ±10%
Surface Finish: Immersion Gold
Solder Mask Color:: Green
Colour of Component Legend: White
Test: 100% Electrical Test prior shipment
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    Rogers RO3035 High Frequency Printed Circuit Board 2-Layer Rogers 3035 30mil 0.762mm PCB with DK3.5 DF 0.0015

    Rogers RO3035 High Frequency Printed Circuit Board 2-Layer Rogers 3035 30mil 0.762mm PCB with DK3.5 DF 0.0015

    (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


    Rogers RO3035 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices. The mechanical properties are consistent. This allows the designer to develop multi-layer board designs without encountering warpages or reliability problems. RO3035 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/℃. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage, after etch and bake, of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/℃, which provides exceptional plated through-hole reliability, even in severe environments.


    Typical applications:

    1) Automotive radar

    2) Cellular telecommunications systems

    3) Datalink on cable systems

    4) Direct broadcast satellites

    5) Global positioning satellite antennas

    6) Patch antenna for wireless communications

    7) Power amplifiers and antennas

    8) Power backplanes

    9) Remote meter readers



    PCB Specifications

    PCB SIZE140 x 52mm=20PCS
    BOARD TYPEDouble sided PCB
    Number of Layers2 layers
    Surface Mount ComponentsYES
    Through Hole ComponentsYES
    LAYER STACKUPcopper ------- 18um(0.5 oz)+plate TOP layer
    RO3035 0.762mm
    copper ------- 18um(0.5 oz) + plate BOT Layer
    TECHNOLOGY
    Minimum Trace and Space:4 mil / 4 mil
    Minimum / Maximum Holes:0.5 mm / 5.0 mm
    Number of Different Holes:11
    Number of Drill Holes:125
    Number of Milled Slots:0
    Number of Internal Cutouts:0
    Impedance Control:no
    Number of Gold finger:0
    BOARD MATERIAL
    Glass Epoxy:RO3035 0.762mm
    Final foil external:1oz
    Final foil internal:N/A
    Final height of PCB:0.8 mm ±0.1mm
    PLATING AND COATING
    Surface FinishImmersion Gold
    Solder Mask Apply To:N/A
    Solder Mask Color:N/A
    Solder Mask Type:LPSM
    CONTOUR/CUTTINGRouting
    MARKING
    Side of Component LegendN/A
    Colour of Component LegendN/A
    Manufacturer Name or Logo:N/A
    VIAPlated through hole(PTH), minimum size 0.5mm.
    FLAMIBILITY RATINGUL 94-V0 Approval MIN.
    DIMENSION TOLERANCE
    Outline dimension:0.0059"
    Board plating:0.0029"
    Drill tolerance:0.002"
    TEST100% Electrical Test prior shipment
    TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
    SERVICE AREAWorldwide, Globally.

    Data Sheet of Rogers 3035 (RO3035)

    RO3035 Typical Value
    PropertyRO3035DirectionUnitsConditionTest Method
    Dielectric Constant,εProcess3.50±0.05Z10 GHz/23IPC-TM-650 2.5.5.5 Clamped Stripline
    Dielectric Constant,εDesign3.6Z8GHz to 40 GHzDifferential Phase Length Method
    Dissipation Factor,tanδ0.0015Z10 GHz/23IPC-TM-650 2.5.5.5
    Thermal Coefficient of ε-45Zppm/10 GHz -50to 150IPC-TM-650 2.5.5.5
    Dimensional Stability0.11
    0.11
    X
    Y
    mm/mCOND AIPC-TM-650 2.2.4
    Volume Resistivity107MΩ.cmCOND AIPC 2.5.17.1
    Surface Resistivity107COND AIPC 2.5.17.1
    Tensile Modulus1025
    1006
    X
    Y
    MPa23ASTM D 638
    Moisture Absorption0.04%D48/50IPC-TM-650 2.6.2.1
    Specific Heatj/g/kCalculated
    Thermal Conductivity0.5W/M/K50ASTM D 5470
    Coefficient of Thermal Expansion
    (-55 to 288
    )
    17
    17
    24
    X
    Y
    Z
    ppm/23/50% RHIPC-TM-650 2.4.4.1
    Td500 TGAASTM D 3850
    Density2.1gm/cm323ASTM D 792
    Copper Peel Stength10.2Ib/in.1oz,EDC After Solder FloatIPC-TM 2.4.8
    FlammabilityV-0UL 94
    Lead-free Process CompatibleYes

    Quality Rogers RO3035 High Frequency Printed Circuit Board 2-Layer Rogers 3035 30mil 0.762mm PCB with DK3.5 DF 0.0015 for sale
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