Sign In | Join Free | My chinalane.org
chinalane.org
Products
Search by Category
Home > Electronic Accessories & Supplies >

Single Layer Flexible Circuit with 1.0mm FR-4 Stiffener and Immersion Gold for Monitoring System

Categories Hybrid PCB Board
Brand Name: Bicheng Enterprise Limited
Model Number: BIC-0276-V2.76
Certification: UL
Place of Origin: CHINA
MOQ: 1 PIECE
Price: USD2 .99-6.99 per piece
Payment Terms: T/T,Paypal
Supply Ability: 50000 PIECE PER MONTH
Delivery Time: 8-9 WORKING DAY
Packaging Details: VACUUM
Board Material: Polyimide 25µm
Board Thickness: 0.15 mm
Surface/Inner layer Cu thickness: 35 µm
Surface Finish: Immersion Gold
Coverlay Colour: Yellow
Color of Silkscreen: White
Function: 100% Pass electrical test
Number of Layers: 2
  • Haven't found right suppliers
  • Our buyer assistants can help you find the most suitable, 100% reliable suppliers from China.
  • And this service is free of charge.
  • we have buyer assistants who speak English, French, Spanish......and we are ready to help you anytime!
  • Submit Buying Request
    • Product Details
    • Company Profile

    Single Layer Flexible Circuit with 1.0mm FR-4 Stiffener and Immersion Gold for Monitoring System

    Single Layer Flexible Circuit with 1.0mm FR-4 Stiffener and Immersion Gold for Monitoring System

    (FPC’s are custom-made products, the picture and parameters shown are just for reference)


    General description

    This is a type of flexible printed circuit for the application of Monitoring Systems. It’s a single layer FPC at 0.15mm thick. FR-4 as stiffener is used on the bottom side. The base laminate is from ITEQ, It’s fabricated per IPC 6012 Class 2 using supplied Gerber data.


    Parameter and data sheet

    Size of Flexible PCB55.11 X 42.31mm
    Number of Layers1
    Board TypeFlex PCB
    Board Thickness0.15mm
    Board MaterialPolyimide 25µm
    Board Material SupplierITEQ
    Tg Value of Board Material60℃
    PTH Cu thickness≥20 µm
    Inner Iayer Cu thicknesN/A
    Surface Cu thickness35 µm
    Coverlay ColourYellow
    Number of Coverlay2
    Thickness of Coverlay25 µm
    Stiffener MaterialFR-4 stiffner
    Stiffener Thickness1.0mm
    Type of Silkscreen InkIJR-4000 MW300
    Supplier of SilkscreenTAIYO
    Color of SilkscreenWhite
    Number of Silkscreen1
    Peeling test of CoverlayNo peelable
    Legend Adhesion3M 90℃ No peeling after Min. 3 times test
    Surface FinishImmersion Gold
    Thickness of Nickle/GoldAu: 0.03µm(Min.); Ni 2-4µm
    RoHS RequiredYes
    Famability94-V0
    Thermal Shock TestPass, -25℃±125℃, 1000 cycles.
    Thermal StressPass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering.
    Function100% Pass electrical test
    WorkmanshipCompliance with IPC-A-600H & IPC-6013C Class 2


    Features and benefits

    Excellent flexibility

    Reducing the volume

    Weight reduction

    Consistency of assembly

    Increased reliability

    The end can be whole soldered

    Low cost

    Continuity of processing

    Quick and on-time delivery

    Eligible products rate of first production: >95%


    Applications

    Toy lamp strip, FFC for industrial control equipment, Tablet PC capacitive screen soft board


    Components of a flexible circuit

    A flexible circuit consists of copper foil, dielectric substrate+ coverlay and adhesive.

    Copper foil is available in two different types of copper: ED Copper and RA copper.


    ED copper is an electro-deposited (ED) copper foil produced in the same way as the copper foil used for rigid printed circuit boards. This also means that the copper is “treated”, i.e., it has a slightly rough surface on one side, which ensures a better adhesion when the copper foil is bonded to the base material.

    RA copper is a rolled and annealed copper foil produced from electrolytically deposited cathode copper, which is melted and cast into ingots. The ingots are first hot-rolled to a certain size and milled on all surfaces. The copper is then cold-rolled and annealed, until the desired thickness is obtained.

    Copper foil is available in thickness of 12, 18, 35 and 70 μm.


    The most common available for dielectric substrate and coverlay is polyimide films. This material can also be used as coverlay. Polyimide is best suited for flexible circuits because of its characteristics as stated below:

    High temperature resistance allows soldering operations without damaging the flexible circuits

    Very good electrical properties

    Good chemical resistance

    Polyimide is available in thicknesses of 12.5, 20, 25 and 50 μm.


    Base laminates for rigid printed circuit boards are copper foils laminated together with the base materials, the adhesive coming from the prepreg material during lamination. Contrary to this is the flexible circuit where the lamination of the copper foil to the film material is achieved by means of an adhesive system. It is necessary to distinguish between two main systems of adhesive, namely thermoplastic and thermoset adhesives. The choice is dictated partly by the processing, and partly by the application of the finished flexible circuit.



    Quality Single Layer Flexible Circuit with 1.0mm FR-4 Stiffener and Immersion Gold for Monitoring System for sale
    Send your message to this supplier
     
    *From:
    *To: Shenzhen Bicheng Electronics Technology Co., Ltd
    *Subject:
    *Message:
    Characters Remaining: (0/3000)
     
    Inquiry Cart 0